振興醫療財團法人振興醫院 朱唯廉科主任, William Chu, MD, Ph. D. 新創技術： 髓腔內鋼釘遠端螺孔定位裝置研發 ▶more 研究專長： 創傷骨科、運動醫學、足踝關節、脊椎骨科、老人醫學、椎體成型術、高頻熱凝療法

現職

振興醫院一般骨科 主任

學歷

國立陽明大學生醫工程研究所 博士
國立陽明大學醫學工程研究所 碩士
國防醫學院醫學系 醫學士

經歷

台北醫學大學附設醫院復健醫學部 主任
台北醫學大學醫學系復健學科 副教授/助理教授
台北醫學大學附設醫院預防醫學暨社區醫學部 副主任

重要發明與專利

• 2015 Chu W.C., Tseng Y.J. and Chu William, Lateral light-emitting device for connecting an intra-medullary guide wire - 可與髓腔導針接合之側向發光裝置. (EU Patent Filed on 2012/11/01. Patent Application No. 12 190 941.0-1654. Patent Granted Notification on 2015/01/15. Patent No.: 2727542)

• 2016 Chu W.C., Tseng Y.J. and Chu William, Lateral light-emitting device for connecting an intra-medullary guide wire - 可與髓腔導針接合之側向發光裝置. (USA Patent Filed on 2012/11/01. Patent Granted Notification on 2016/07/29. Patent Proclamation No.: US9480487 B2)

• 2016 Chu W.C., Tseng Y.J. and Chu William, Low-resistance Kyphoplasty Kid – 低阻抗椎體擴張後凸矯形術裝置. (USA Provisional Patent Filed on 2016/12/08. Patent Filing No.: 62/431,540)

• 2018 Chu W.C., Tseng Y.J. and Chu William, Low-resistance Kyphoplasty Kid – 負壓引導之骨水泥注射系統. (Taiwan ROC Patent Filed on 2017/12/7. Patent Application No. 106142980. Patent granted on 2018/10. Patent No.: 發明第 I 646987 號, 2019/1/11 – 2037/12/6)

• 2018 Chu W.C., Tseng Y.J. and Chu William, Low-resistance Kyphoplasty Kid – 低阻抗椎體擴張後凸矯形術裝置. (PCT Patent Filed on 2017/12/08, Application No. PCT/CN2017/115303；Publication Date on 2018/06/14, Publication No. WO2018/103742)

• 2019 intra-Medullary Endo-Transilluminating (iMET) Device – WeMed Speculum and Accessories (Non-Steriled), Taiwan Food & Drug Administration (TFDA) Class-I approval, received May 10, 2019 (衛部醫器製壹字第 007757號. 2019/5/10 ~ 2024/5/10)

• 2019 Chu W.C., Tseng Y.J. and Chu William, Low-resistance Kyphoplasty Kid – 負壓引導之骨水泥注射系統. (USA Patent Application Filed on 2019/06/25. Application No. 16/473,428; International Application No. PCT/CN2017/115303)

• 2019 Chu W.C., Tseng Y.J. and Chu William, Low-resistance Kyphoplasty Kid – 負壓引導之骨水泥注射系統. (Japan Patent Application Filed on 2019/07/08. 国際出願番号 PCT/CN2017/115303)

• 2019 Chu W.C., Tseng Y.J. and Chu William, Low-resistance Kyphoplasty Kid – 負壓引導之骨水泥注射系統. (EU Patent Application Filed on 2019/07/08. Submission No. 7644689; EP Application No. 17878176.1; PCT Application No. PCT/CN2017115303)

• 2019 Chu W.C., Tseng Y.J. and Chu William, Low-resistance Kyphoplasty Kid – 負壓引導之骨水泥注射系統. (China Patent Application Filed on 2019/08/08. PCT Patent Application No. PCT/CN2017/115303, Application Filed on 2017/12/08; Priority Date: 2016/12/08; Publication No. WO2018/103742, Publication Date: 2018/06/14)